16 GB LPDDR5 DRAM

Samsung Starts Mass Production of First 16 GB LPDDR5 DRAM for Next-Gen Premium Smartphones

Samsung has begun producing DDR5 DRAM which is potentially the fastest memory in the world to be used on smartphones and mobile devices.

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The device is a 16 GB LPDDR5 chip manufactured with 10 nm technology capable of transferring data at 5,500 megabits per second. That’s about 1.3 times faster than the previous LPDDR4X memory. The chip is also 20 percent more energy efficient.

This memory device is likely to see widespread use in 5G devices, but artificial intelligence and gaming are also chip strengths that will surely see adoption on the high-end smartphones.

> Read Next: That’s all we know about the AMD Ryzen Threadripper 3990X

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Micron introduces the next-gen of Crucial Ballistix gaming memory

Crucial Ballistix gaming memory series consists of two lines: Crucial Ballistix and Crucial Ballistix MAX.

Micron, the parent company of Crucial Memory, has announced the next generation of Ballistix gaming memory. The memory was introduced during the CES2020 and was created with the help of Micron components intended to deliver high-frequency, low-latency, KitGuru reports.

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Cruicial Ballistix memory modules reach speeds between 2400MHz and 3600MHz, with capacities from 4 GB to 32 GB. Crucial Ballistix has an up-to-date black heat conductor, eight RGB zones with 16 LEDs that can be controlled with the help of popular lighting control software. Memory is available in DIMM format or SODIMM laptop.

Crucial Ballistix MAX Series

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The new Crucial Ballistix MAX Series further boosts the speed from 4000MHz to 4400MHz on modules between 8GB and 16GB. The memory features a black aluminum heat conductor and integrated thermal sensors for maximum real-time heat dissipation and monitoring. RGB lighting is also available, which can be controlled with the help of ASUS Aura Sync, Gigabyte RGB Fusion and MSI Mystic Light software.

The Crucial Ballistix and Ballistix Max Memories will go on sale from February 4th.

> Read Next: ADATA XPG Sage PCIe 4.0 SSD reaches read speed of 7 GB/s

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G.Skill introduces new 32 GB DDR4 memory modules

G.Skill has announced new high capacity, low latency DDR4-3200 CL14-18-18-38 memory kits. The memory is based on 32GB modules within the Trident Z RGB, Trident Z Royal and Trident Z Neo series, and is available in 256GB (32GBx8), 128GB (32GBx4) and 64GB (32GBx2) kits.

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The memory is designed for HEDT platforms with four-channel support, while 256 GB (32GBx8) DDR4-3200 CL14-18-18-38 module specifications are validated on Intel Core i9-10900X processor and ASUS ROG RAMPAGE VI EXTREME ENCORE motherboard, as does the Intel Core i9-10940X processor and the MSI Creator X299 motherboard.

In addition, the new G.Skill DDR4 32GB memory modules are optimized to take full advantage of the 3rd generation AMD Ryzen Threadripper platform, so memory is also available in DDR4-3200 CL14-18-18-38 modules 256GB (32GBx8) for AMD Trident Z Neo compatible series. Memory is validated on AMD Ryzen Threadripper 3960X processor and ASUS ROG ZENITH II EXTREME motherboard.

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As part of the Trident Z Neo series, the new DDR4 memory will also be available for the AMD X570 platform at 128 GB (32GBx4) and 64 GB (32GBx2) capacities.

The new high-capacity, low-latency G.Skill memory with support for Intel XMP 2.0 for easy overclocking and will be available in the first quarter of 2020.

> Read Next: OnePlus 7T: If you are looking for excellence but without spending too much this is the phone to buy!

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neoadviser – TECH

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