Gigabyte adds a 20 Gbps USB 3.2 Gen 2x2 PCIe card to its line

Gigabyte adds a 20 Gbps USB 3.2 Gen 2×2 PCIe card to its line

Gigabyte has announced that it has added a new PCIe Expansion card to its line of products, which will allow users to place the 20 Gbps USB 3.2 Gen 2×2 connector on their PC, TechPowerUp reports.

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The solution mentioned has no hub, as it is a connector, which significantly limits its user value. According to the company, this solution is intended for users who are happy with current systems but want support for the newest standards, which eliminates the need to update motherboards before the time comes.

Users will have to sacrifice a PCIe x4 slot to insert a 20 Gbps USB 3.2 Gen 2×2 PCIe card. The price and availability of the device at this time are not known.

> Read Next: Here’s how the new Facebook design will look like

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Intel 665p SSD

Intel brings the 665p SSD with the second-generation QLC NAND 96 layer

NAND technology is continuing to evolve, enabling improved performance, lower pricing and stronger market competition. QLC NAND is one of the latest NAND innovations, which increases the density of NAND space to enable more storage at a lower cost, reports Overclock3D.

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Intel 660p has quickly become one of the most popular QLC-based SSDs, and is now changing to the Intel 665p model. The newer model uses Intel’s second-generation QLC NAND, which features 96 layers instead of 64-layer NANDs used by the 660p SSD model.

Intel 660p SSD
Intel 660p SSD

Intel 665p uses the Silicon Motion controller SM2263 (same as the 660p model), so all performance improvements come from Intel’s NAND changes. The company will launch the aforementioned SSD with 1TB and 2TB capacity.

The new SSD enables significant performance improvements in the data recording and reading segment as well as up to 50% stability, and this is especially true for the 2TB model. Intel plans to launch the 665p SSD on the market in early 2020.

> Read Next: Mediatek 5G chipset in AnTuTu achieves better results than Snapdragon 855 and Kirin 990 5G

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Mediatek 5G

Mediatek 5G chipset in AnTuTu achieves better results than Snapdragon 855 and Kirin 990 5G

MediaTek was preparing to launch its premium 5G chipset. Prior to the announcement, the labeled MediaTek MT6889 chipset appeared on the AnTuTu benchmark, while interestingly it outperforms current premium models like the Qualcomm Snapdragon 855 and Kirin 990 5G, reports DroidShout.

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In the AnTuTu results, the MediaTek processor scored a total of 511,363 points on the Antutu V8 version. The CPU achieved a score of 161.266 points, while the GPU reached 196.097 points. 

Mediatek 5G
Mediatek 5G

In addition, AI-benchmark benchmarking suggests that the MediaTek MT6889 SoC achieved better results than Qualcomm Snapdragon 855 Plus and Kirin 990 5G chips.

MediaTek MT6889 SoC
MediaTek MT6889 SoC AI-benchmark comparison

It is already known that the MT6889 is based on the 7nm FinFET process, which uses the ARM Cortex A77 architecture and the Mali-G77 GPU. The chipset has a built-in 5G Helio M70 modem, which offers downlink speeds of 4.7Gbps and uplink speeds of 2.5Gbps.

It is not yet known which phone manufacturers will implement the aforementioned premium MediaTek chipset.

> Read Next: Mediatek and Intel planning to bring 5G for Dell and HP laptops

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AMD Ryzen Threadripper 3990X

AMD Ryzen Threadripper 3990X is the world’s first 64-core HEDT processor

AMD‘s third-generation Ryzen Threadripper processor line is already making significant performance improvements in the HEDT market, but AMD has not yet finished bringing improvements in this area, reports Overclock3D.

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The company offers the even larger Ryzen Threadripper processor, which implements 64 cores, 128 threades and 288MB of combined L2 and L3 cache memory. AMD thus created the HEDT processor, which has twice as many cores as the Ryzen Threadripper 3970X and significantly outperforms Intel’s HEDT solutions.

So far, the company has only confirmed the combined cache size, 280W TDP and number of CPU cores. The processor is supposed to be based on AMD’s motherboard platform, the TRX40, enabling content creators to have more core than any single-socket HEDT processor to date.

AMD pointed that more information can be expected in 2020, with the Threadripper 3990X likely to be revealed during the CES 2019 fair.

> Read Next: Galaxy S11+ visual concepts are here, may come with 5 cameras on the back

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The first information on the performance of Radeon RX 5500 graphics card are here

The first information on the performance of Radeon RX 5500 graphics card are here

With the release of the Radeon Navi gaming graphics card generation, AMD has brought the new 7nm RDN architecture of graphics processors, which at first glance is better than previous GCNs in terms of lower power consumption energy and achieving higher functional frequencies, reports Wccftech.

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Last month AMD introduced a model based on the Radeon RX 5500 Navi, which should replace the current RX 570 and RX 580 Polaris models. Although this card has not yet been launched in the market, the first unofficial results have been unveiled. They show that the RX 5500 achieves the performance level of the RX 580, reaching 12111 points in the 3D Fire Strike test (RX 580 – 12,744; GeForce GTX 1660 – 12525).

In terms of consumption, Radeon RX 5500 significantly reduces the amount of power it needs, which consumes 133W when loaded into games, which is significantly lower than the RX 580’s (207W) consumption, and is almost equal while competing with GTX 1660 (128W) model.

In terms of gaming performance, the results were as follows:

  • 1080p Tomb Raider – RX 5500 offers 59 fps, RX580 65 fps, and GTX 1660 69 fps.
  • In the 1080p Far Cry 5 test, the RX 5500 reaches 72 fps, the RX 580 75 fps, and the GTX 1660 85 fps.

As we can see, the new “mainstream” representative Radeon Navi marks a significant reduction in consumption, providing almost the same level of performance as Polaris’ predecessor. The launch of the new RX 5500 is scheduled for next month.

> Read Next: Increased the smartphone sales on Europe: How Samsung, Huawei, Apple and Xiaomi are compared

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GeForce GTX 1650 Super arrives - a new hit for "mainstream" public gaming

GeForce GTX 1650 Super arrives – a new hit for “mainstream” public gaming

Nvidia has officially launched the GeForce GTX 1650 Super graphics card, which is projected to be a strong mid-range gaming acceleration superstar.

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Preliminary results suggest that the GTX 1650 Super is 50% faster than the similar GTX 1650 model and twice as fast as the GTX 1050 positioned earlier in the same class.

The GeForce GTX 1650 Super uses a Turing-class graphics processor with 1280 CUDA executable cores and a base frequency of 1530 MHz, while in turbo mode up to 1725 MHz. It is equipped with 4 GB of GDDR6 fast video memory, and the charge is set at the 100W limit.

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SSD drives are entering in the era of terabytes (TB) models

SSD drives are entering in the era of terabytes (TB) models

The ultimate protective wall of mechanical hard drives (HDD) before much faster and safer NAND flash technology is the high capacity and the lowest cost per GB of disc space. However, even this wall is slowly collapsing as the technology of flash memory production is advancing day by day.

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The moment when hard drives will be permanently placed on museum shelves is approaching, as the latest Hynix news confirms that this will happen much sooner than most of us expect, reports ITHome.

SK Hynix, one of the world’s leading memory manufacturers, has launched the first pre-production models of 128-layer 4D NAND memory based SSDs. The test products have been delivered to the major Hynix partners for the purpose of testing their performance characteristics, namely 1 TB flash drive, 2 TB SSD drive so-called client device, which we all use today on PC and SSD models designed for the business environment, with a capacity of up to 16 TB.

SK Hynix has begun mass production of 128-layer 1Tb TLC NAND chips this June. This month has delivered the first UFS 3.1 terabyte modules for the needs of mobile phone manufacturers based on 128-layer 4D NAND technology. As current models of 1 TB SSDs require the use of a large number of chips, with the new SK Hynix memory the number of chips needed has been halved. Also, the physical dimensions have been reduced because they are only 1mm thin and are therefore ideal for use on 5G ultra-thin smartphone models.

It is assumed that mobile phones with the next generation of flash memory will appear on the market in the second half of next year.

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AMD Zen 3 will bring new architecture

AMD Zen 3 will bring new architecture

Sources close to the manufacturer claim that the work on architectural design has already been completed and, according to their information, Zen 3 will be an evolution of the existing Zen 2. However, the latest release from AMD says that Zen 3 will be based on a completely new resource architecture, reports The Street.

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When asked during the interview about Milan processors, which are actually the third generation of EPYC server processors and what the IPC acceleration will be compared to existing Zen 2 models, he replied that Zen 3 is not a simple evolution as it was Zen 2 compared to Zen models, but it’s a completely new processor architecture, so the performance boost will be significantly larger, enough to fully meet the high expectations regarding generation capabilities and speed of future Zen processors.

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Biostar: AMD B550 and Intel 400 series motherboards are ready

Biostar: AMD B550 and Intel 400 series motherboards are ready

Representatives of BIOSTAR announced that they have ready the new motherboard models based on the AMD B550 chipset, which should replace the very popular and affordable “mainstream” B450 models.

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The new chipset is more compatible with the features of the new AMD Ryzen 3000 CPU series due to support for PCIe v4.0 standard for faster data transfer at double the maximum transfer speed compared to PCIe v3.0 used by current B450 models. The new chipset also brings support for both USB 3.2 Gen2 ports and 6x USB 2.0 interface, reports BrainBox Korea.

In addition to support for the AMD processor platform, Biostar also expects innovations from Intel. To meet the upcoming Intel Comet Lake-S processor release for the desktop platform, this manufacturer has prepared new motherboards based on the Intel 400 series of chips. The Intel Z490 targets the high end market, while the B460 and H410 models will be positioned in the middle and bottom price category.

The new Intel chipset will have basic support for standard WiFi 6 high speed wireless network operation, while the entire platform will have 40 PCIe v3.0 communication channels available. From these, 16 are dedicated for direct communication of CPUs and graphics cards, the other four are intended for direct communication of processors and chipsets.

Unfortunately, the CPU and chipset are still connected through the DMI 3.0 interface, which actually represents a major drawback for the Intel platform as it has the width of the 4 PCIe v3.0 bus. This practically means that these 20 additional PCIe v3.0 transport chips available on the chips have limited usable benefits, given the narrow bottleneck described in data sharing with CPU.

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Ryzen 9 3950X destroys Intel's competition

Ryzen 9 3950X destroys Intel’s competition

AMD Ryzen 9 3950X was officially launched days ago. The first 16-core processor destined for the “mainstream” platform has shown impressive performance. The current competition in this segment of Intel Core, simply put, has no chance against the uncompromising Zen 2 16-core processor which doubles the number of logic cores.

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Performance differences when compared to the currently strongest Intel Core LGA 1151 in the form of the Core i9-9900K are huge, which will certainly lead to a further drop in the price of Intel chips. And even then, they are less and less attractive to users as 14nm technology is definitely becoming surpassed as well as any further acceleration efforts at 5 GHz due to high power consumption and heat.

This is why the Ryzen 9 3950X looks like a gem of 7nm technology, with which AMD is demonstrating its achievements in the field of CPUs. And not only that, with this model, the company also attacks the HEDT segment of the LGA2066 and Threadripper models, showing how “fragile” the Ryzen 3000 series processor can be. So it will definitely be of interest to professionals on a smaller budget.

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