G.Skill has announced new high capacity, low latency DDR4-3200 CL14-18-18-38 memory kits. The memory is based on 32GB modules within the Trident Z RGB, Trident Z Royal and Trident Z Neo series, and is available in 256GB (32GBx8), 128GB (32GBx4) and 64GB (32GBx2) kits.
The memory is designed for HEDT platforms with four-channel support, while 256 GB (32GBx8) DDR4-3200 CL14-18-18-38 module specifications are validated on Intel Core i9-10900X processor and ASUS ROG RAMPAGE VI EXTREME ENCORE motherboard, as does the Intel Core i9-10940X processor and the MSI Creator X299 motherboard.
In addition, the new G.Skill DDR4 32GB memory modules are optimized to take full advantage of the 3rd generation AMD Ryzen Threadripper platform, so memory is also available in DDR4-3200 CL14-18-18-38 modules 256GB (32GBx8) for AMD Trident Z Neo compatible series. Memory is validated on AMD Ryzen Threadripper 3960X processor and ASUS ROG ZENITH II EXTREME motherboard.
As part of the Trident Z Neo series, the new DDR4 memory will also be available for the AMD X570 platform at 128 GB (32GBx4) and 64 GB (32GBx2) capacities.
The new high-capacity, low-latency G.Skill memory with support for Intel XMP 2.0 for easy overclocking and will be available in the first quarter of 2020.
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